---
publication_id: "OT-2026-000000334"
title: "Laser cutting method using spatial light modulator and laser cutting device"
published_at: "2026-09-15T19:02:45.674050Z"
canonical_url: "https://opentechnical.org/p/OT-2026-000000334"
categories:
  - "manufacturing-assembly-equipment/joining-and-welding"
keywords:
  - "b23k26/0648"
  - "b23k2103/50"
  - "b23k26/38"
---

# Laser cutting method using spatial light modulator and laser cutting device

## Abstract

The present disclosure provides a laser cutting method comprising steps of: (a) emitting a laser light to a spatial light modulator that has a plurality of pixels; (b) the laser light modulated by the spatial light modulator being irradiated on an uncut object, which is to be cut, for forming a focal point and cutting the uncut object; (c) measuring a cutting depth of the object; (d) the spatial light modulator converting a phase of each of the laser light modulated by each of the pixels to change a light pattern distribution at the focal point when the cutting depth of the object reaches a first predetermined depth; and (e) repeating the step (b) to the step (d) until the cutting depth of the object reaches a second predetermined depth; wherein the first predetermined depth is varied when the step (b) to the step (d) are repeated.