OPENTECHNICAL PUBLICATION
OT-2026-000000342

Laser machining device, wafer processing system, and method for controlling laser machining device

Published: 2026-09-15T19:02:46.228986Z
Permanent URL: https://opentechnical.org/p/OT-2026-000000342
Categories: Manufacturing & Assembly Equipment > Joining and Welding

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ABSTRACT

The laser machining device includes an observation image acquiring unit
configured to repeatedly acquire an observation image of a machining spot of
laser light emitted from a laser optical system to a street on a wafer while a
machined groove is being formed, a luminance detector configured to detect a
luminance of a plasma generated at the machining spot by emission of the laser
light based on the observation image every time the observation image
acquiring unit acquires the observation image, a correspondence information
obtaining unit configured to obtain correspondence information indicating a
correspondence relationship among the luminance, energy of the laser light and
a machined state of the machined groove, and a machined state assessing unit
configured to assess the machined state with reference to the correspondence
information based on the luminance and known energy of the laser light every
time the luminance detector detects the luminance.

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OpenTechnical publication OT-2026-000000342
Published 2026-09-15T19:02:46.228986Z
https://opentechnical.org/p/OT-2026-000000342