{
  "abstract": "The present disclosure relates to a bonding strength inspection apparatus capable of inspecting a bonding strength of a bonding part without destruct an inspection target. The present disclosure provides a bonding strength inspection apparatus including a roughness measurement part configured to measure a roughness of a bonding part in which a base metal and a bonding member are bonded to each other; and a processor configured to determine a bonding strength of the bonding part based on the roughness.",
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  "title": "Bonding strength inspection apparatus and bonding system",
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