{
  "abstract": "Provided herein may be a dechuck control method, a dechuck control system, and a method of transferring a substrate. The dechuck control method may include: providing a substrate and a carrier coupled to each other by an adhesive chuck; pushing the substrate by a dechuck pin including a pressure sensor, and acquiring, by the pressure sensor, pressure data associated with pushing the substrate by the dechuck pin; and controlling an operation of the dechuck pin based on the pressure data.",
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  "title": "Dechuck control method, dechuck control system, method of transferring substrate",
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}