{
  "abstract": "A system of processing a substrate includes an atmospheric-pressure transfer chamber, at least one vacuum processing chamber, at least two load-lock modules, a vacuum transfer chamber, a plurality of load ports, and a first transfer mechanism and a second transfer mechanism. The load ports are attached to the atmospheric-pressure transfer chamber and detachable containers are mounted on the load ports, respectively. A controller controls the first transfer mechanism and the second transfer mechanism to concurrently transfer a used consumable from the containers to the vacuum processing chamber through the atmospheric-pressure transfer chamber and one of the load-lock modules and to transfer a used consumable from the vacuum processing chamber through the vacuum transfer chamber and another one of the load-lock modules.",
  "assignees": [
    "TOKYO ELECTRON LTD"
  ],
  "authors": [
    "KAISE SEIICHI",
    "NUMAKURA MASAHIRO",
    "TAKEYAMA YUKI",
    "TOYOMAKI TOSHIAKI"
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  "published_at": "2026-09-15T19:04:11.108705Z",
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  "source_date": "2026-04-02",
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  "supersedes": null,
  "title": "System of processing substrate, transfer method, transfer program, and holder",
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