{
  "abstract": "The present invention relates to a bonding apparatus for a power terminal of a heating plate, for bonding the power terminal supplying power to a heating wire of a substrate. The bonding apparatus for a power terminal of a heating plate comprises: a chamber; a stage which is disposed in an inner space of the chamber and on which the substrate is placed; an upper press portion disposed in the inner space of the chamber to face the stage, provided to be vertically movable, and having a terminal fixing portion configured to fix the power terminal; and an elevating driver configured to move the upper press portion up and down, wherein the terminal fixing portion further includes a magnetic holder configured to hold the power terminal by a magnetic force.",
  "assignees": [
    "SEMES CO LTD"
  ],
  "authors": [
    "CHO MIN HEE",
    "SONG JUN HO"
  ],
  "canonical_url": "https://opentechnical.org/p/OT-2026-000001359",
  "categories": [
    "manufacturing-assembly-equipment/joining-and-welding"
  ],
  "extent": {
    "figures": 0,
    "paragraphs": 0,
    "words": 130
  },
  "figures": [],
  "files": [
    {
      "bytes": 9911,
      "media_type": "text/html; charset=utf-8",
      "name": "index.html",
      "sha256": "6a4369d46bcbc94d0570e584dd9e464445837ec2e9e1b2f28468bbb570e1b3fc"
    },
    {
      "bytes": 1244,
      "media_type": "text/markdown; charset=utf-8",
      "name": "publication.md",
      "sha256": "fa0a35481e773513846bd34fb828a6db69e90c757b15772fc2591b347fc874d3"
    },
    {
      "bytes": 1326,
      "media_type": "text/plain; charset=utf-8",
      "name": "publication.txt",
      "sha256": "696ebd790c7d494a5c531699f64b023d5ee7bf811a08831f36e1819b3206be07"
    }
  ],
  "integrity": {
    "hash_algorithm": "sha256",
    "keys_url": "https://opentechnical.org/integrity/keys",
    "record_url": "https://opentechnical.org/p/OT-2026-000001359/integrity",
    "signature_algorithm": "Ed25519",
    "signature_file": "manifest.sig",
    "verify_url": "https://opentechnical.org/integrity/verify"
  },
  "keywords": [
    "b23k1/0016",
    "b23k1/0016",
    "b23k20/02",
    "h10p72/0432",
    "h10p72/0432",
    "b23k1/00"
  ],
  "language": "en",
  "license": {
    "name": "Creative Commons Attribution 4.0 International",
    "url": "https://creativecommons.org/licenses/by/4.0/"
  },
  "publication_id": "OT-2026-000001359",
  "published_at": "2026-09-15T19:05:20.764592Z",
  "publisher": "Nebula Innovations Limited",
  "record_type": "record",
  "schema": "opentechnical-publication-manifest/1.0",
  "source_date": "2026-03-31",
  "source_id": "US-12589444-B2",
  "source_name": "the United States Patent and Trademark Office",
  "source_url": "https://patents.google.com/patent/US12589444B2",
  "supersedes": null,
  "title": "Bonding apparatus and bonding power terminal of heating plate",
  "uuid": "01a0a675-9c7c-755a-aa5c-3e2173876696"
}