---
publication_id: "OT-2026-000001359"
title: "Bonding apparatus and bonding power terminal of heating plate"
published_at: "2026-09-15T19:05:20.764592Z"
canonical_url: "https://opentechnical.org/p/OT-2026-000001359"
categories:
  - "manufacturing-assembly-equipment/joining-and-welding"
keywords:
  - "b23k1/0016"
  - "b23k1/0016"
  - "b23k20/02"
  - "h10p72/0432"
  - "h10p72/0432"
  - "b23k1/00"
---

# Bonding apparatus and bonding power terminal of heating plate

## Abstract

The present invention relates to a bonding apparatus for a power terminal of a heating plate, for bonding the power terminal supplying power to a heating wire of a substrate. The bonding apparatus for a power terminal of a heating plate comprises: a chamber; a stage which is disposed in an inner space of the chamber and on which the substrate is placed; an upper press portion disposed in the inner space of the chamber to face the stage, provided to be vertically movable, and having a terminal fixing portion configured to fix the power terminal; and an elevating driver configured to move the upper press portion up and down, wherein the terminal fixing portion further includes a magnetic holder configured to hold the power terminal by a magnetic force.