OPENTECHNICAL PUBLICATION
OT-2026-000001359

Bonding apparatus and bonding power terminal of heating plate

Published: 2026-09-15T19:05:20.764592Z
Permanent URL: https://opentechnical.org/p/OT-2026-000001359
Categories: Manufacturing & Assembly Equipment > Joining and Welding

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ABSTRACT

The present invention relates to a bonding apparatus for a power terminal of a
heating plate, for bonding the power terminal supplying power to a heating
wire of a substrate. The bonding apparatus for a power terminal of a heating
plate comprises: a chamber; a stage which is disposed in an inner space of the
chamber and on which the substrate is placed; an upper press portion disposed
in the inner space of the chamber to face the stage, provided to be vertically
movable, and having a terminal fixing portion configured to fix the power
terminal; and an elevating driver configured to move the upper press portion
up and down, wherein the terminal fixing portion further includes a magnetic
holder configured to hold the power terminal by a magnetic force.

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OpenTechnical publication OT-2026-000001359
Published 2026-09-15T19:05:20.764592Z
https://opentechnical.org/p/OT-2026-000001359