---
publication_id: "OT-2026-000002237"
title: "Jigs and methods of teaching substrate handling in semiconductor processing systems using jigs"
published_at: "2026-09-15T19:11:39.849774Z"
canonical_url: "https://opentechnical.org/p/OT-2026-000002237"
categories:
  - "robotics-automation/robot-architectures"
keywords:
  - "b25j9/1656"
  - "b25j9/1656"
  - "h10p72/3302"
  - "h10p72/50"
  - "b25j11/00"
  - "b25j11/0095"
---

# Jigs and methods of teaching substrate handling in semiconductor processing systems using jigs

## Abstract

A jig includes a disc body, a fixation pin, and a verification pin. The disc body has a first surface, an opposite a second surface, and a thickness separating the first surface from the second surface. A fixation aperture and a verification aperture extend through the thickness of the disc body and couple the first surface to the second surface of the disc body, the fixation aperture located radially outward of the verification aperture. The fixation pin is arranged to be slidably received within the fixation aperture to fix the disc body to an end effector within the semiconductor processing system. The verification pin is arranged to be slidably received within the verification aperture and supported by the disc body to indicate misregistration between the disc body and a load lock in the semiconductor processing system.