{
  "abstract": "A wafer transfer apparatus includes a plate, a first belt unit on a first surface of the plate and including a first linear motion (LM) guide movable up and down, a second belt unit on the first surface of the plate and including a second LM guide movable up and down, a robot between the first belt unit and the second belt unit connected to the first LM guide and the second LM guide, and configured to transfer a wafer in a vertical direction, and a buffer unit between the first belt unit and the second belt unit in a first direction and disposed between the plate and the robot in a second direction perpendicular to the first direction, wherein the buffer unit includes a plurality of centrifugal fans configured to discharge fluid from an inner space of the buffer unit to an outside of the buffer unit.",
  "assignees": [
    "SAMSUNG ELECTRONICS CO LTD"
  ],
  "authors": [
    "CHOI JIN HYUK",
    "CHUN HYUN SOO",
    "HWANG BEOM SOO",
    "JEON HYUN JOO",
    "LEE KONG WOO",
    "LEE KYU SANG",
    "SONG MYUNG KI",
    "UH JI HO"
  ],
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  "publication_id": "OT-2026-000002827",
  "published_at": "2026-09-15T19:15:36.927824Z",
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  "source_date": "2026-02-17",
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  "supersedes": null,
  "title": "Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus",
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