---
publication_id: "OT-2026-000002827"
title: "Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus"
published_at: "2026-09-15T19:15:36.927824Z"
canonical_url: "https://opentechnical.org/p/OT-2026-000002827"
categories:
  - "material-handling/conveying-systems"
keywords:
  - "b65g47/90"
  - "b65g47/90"
  - "h10p72/3218"
  - "b65g47/90"
  - "h10p72/3302"
  - "h10p72/3402"
---

# Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus

## Abstract

A wafer transfer apparatus includes a plate, a first belt unit on a first surface of the plate and including a first linear motion (LM) guide movable up and down, a second belt unit on the first surface of the plate and including a second LM guide movable up and down, a robot between the first belt unit and the second belt unit connected to the first LM guide and the second LM guide, and configured to transfer a wafer in a vertical direction, and a buffer unit between the first belt unit and the second belt unit in a first direction and disposed between the plate and the robot in a second direction perpendicular to the first direction, wherein the buffer unit includes a plurality of centrifugal fans configured to discharge fluid from an inner space of the buffer unit to an outside of the buffer unit.