---
publication_id: "OT-2026-000002883"
title: "Semiconductor device manufacturing device and manufacturing method"
published_at: "2026-09-15T19:15:58.178209Z"
canonical_url: "https://opentechnical.org/p/OT-2026-000002883"
categories:
  - "robotics-automation/robot-architectures"
keywords:
  - "b25j15/0616"
  - "h01l21/6838"
  - "h10p72/0438"
  - "h10p72/78"
  - "h10w72/0711"
  - "b25j15/06"
---

# Semiconductor device manufacturing device and manufacturing method

## Abstract

This semiconductor device manufacturing device comprises: a stage; a bonding head; a copying mechanism provided on the bonding head; and a controller that executes the copying process to adjust a facing surface to be parallel to a reference plane by having the facing surface, which is a holding surface or a chip end face, follow the reference plane 110 , which is a planar surface of the stage or a substrate. In the copying process, the controller moves the bonding head relative to the surface direction of the reference plane with the facing surface left abutting the reference plane in a state with the copying mechanism switched to a free state, until the axial direction position of the bonding head reaches a stipulated reference position, and when the axial direction position reaches the reference position, switches the copying mechanism to a locked state.