OPENTECHNICAL PUBLICATION
OT-2026-000002883

Semiconductor device manufacturing device and manufacturing method

Published: 2026-09-15T19:15:58.178209Z
Permanent URL: https://opentechnical.org/p/OT-2026-000002883
Categories: Robotics & Automation > Robot Architectures

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ABSTRACT

This semiconductor device manufacturing device comprises: a stage; a bonding
head; a copying mechanism provided on the bonding head; and a controller that
executes the copying process to adjust a facing surface to be parallel to a
reference plane by having the facing surface, which is a holding surface or a
chip end face, follow the reference plane 110 , which is a planar surface of
the stage or a substrate. In the copying process, the controller moves the
bonding head relative to the surface direction of the reference plane with the
facing surface left abutting the reference plane in a state with the copying
mechanism switched to a free state, until the axial direction position of the
bonding head reaches a stipulated reference position, and when the axial
direction position reaches the reference position, switches the copying
mechanism to a locked state.

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OpenTechnical publication OT-2026-000002883
Published 2026-09-15T19:15:58.178209Z
https://opentechnical.org/p/OT-2026-000002883