OPENTECHNICAL PUBLICATION
OT-2026-000003079

Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same

Published: 2026-09-15T19:24:24.243960Z
Permanent URL: https://opentechnical.org/p/OT-2026-000003079
Categories: Tools & Tooling > Clamping Tools

------------------------------------------------------------------------

ABSTRACT

A semiconductor wafer assembly is constituted such that the back surface of a
tape is stuck to the surface of a frame and a semiconductor wafer is stuck to
the surface of the tape. A machining apparatus has chuck tables for supporting
the semiconductor wafer assembly, and each of the chuck tables has a
semiconductor wafer placing surface for supporting the back surface of the
tape to which the semiconductor wafer is stuck and an annular frame placing
surface for supporting the back surface of the frame, formed, in the outer
peripheral side of the semiconductor wafer mounting surface, at a position
below the semiconductor wafer placing surface with a level difference
therebetween.

1. Drawings

[0001] Sheet 1.

[0002] Sheet 2.

[0003] Sheet 3.

[0004] Sheet 4.

[0005] Sheet 5.

[0006] Sheet 6.

[0007] Sheet 7.

------------------------------------------------------------------------

OpenTechnical publication OT-2026-000003079
Published 2026-09-15T19:24:24.243960Z
https://opentechnical.org/p/OT-2026-000003079