---
publication_id: "OT-2026-000003256"
title: "Pressure activated diaphragm bonder"
published_at: "2026-09-15T19:57:12.129784Z"
canonical_url: "https://opentechnical.org/p/OT-2026-000003256"
categories:
  - "manufacturing-assembly-equipment/joining-and-welding"
keywords:
  - "b23k1/008"
  - "b23k1/008"
  - "b23k1/0004"
  - "b23k1/0004"
  - "b23k2101/40"
  - "b23k2101/40"
---

# Pressure activated diaphragm bonder

## Abstract

A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.

## 1. Drawings

[0001] Sheet 1.

[0002] Sheet 2.

[0003] Sheet 3.