OPENTECHNICAL PUBLICATION
OT-2026-000003256

Pressure activated diaphragm bonder

Published: 2026-09-15T19:57:12.129784Z
Permanent URL: https://opentechnical.org/p/OT-2026-000003256
Categories: Manufacturing & Assembly Equipment > Joining and Welding

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ABSTRACT

A device is available for bonding one component to another, particularly for
bonding electronic components of integrated circuits, such as chips, to a
substrate. The bonder device in one embodiment includes a bottom metal block
having a machined opening wherein a substrate is located, a template having
machined openings which match solder patterns on the substrate, a thin
diaphragm placed over the template after the chips have been positioned in the
openings therein, and a top metal block positioned over the diaphragm and
secured to the bottom block, with the diaphragm retained therebetween. The top
block includes a countersink portion which extends over at least the area of
the template and an opening through which a high pressure inert gas is
supplied to exert uniform pressure distribution over the diaphragm to keep the
chips in place during soldering. A heating means is provided to melt the
solder patterns on the substrate and thereby solder the chips thereto.

1. Drawings

[0001] Sheet 1.

[0002] Sheet 2.

[0003] Sheet 3.

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OpenTechnical publication OT-2026-000003256
Published 2026-09-15T19:57:12.129784Z
https://opentechnical.org/p/OT-2026-000003256