---
publication_id: "OT-2026-000003468"
title: "Suction device"
published_at: "2026-09-15T20:31:25.426194Z"
canonical_url: "https://opentechnical.org/p/OT-2026-000003468"
categories:
  - "lifting-positioning-manipulation/vacuum-lifting"
keywords:
  - "h10p72/78"
  - "h10p72/78"
  - "h10p72/78"
  - "y10t29/53191"
  - "y10t29/53191"
---

# Suction device

## Abstract

Suction device for handling a semiconductor wafer comprises a handling section having a plurality of suction ports opened in the same plane as the surface of the wafer and located within an area smaller than that of the surface of the wafer, a pressure reduction device connected to the suction port, an opening acts to release negative pressure produced by the pressure reduction device when a finger is released therefrom, and a grip integrally coupled to the handling section.

## 1. Drawings

[0001] Sheet 1.