OPENTECHNICAL PUBLICATION
OT-2026-000003468

Suction device

Published: 2026-09-15T20:31:25.426194Z
Permanent URL: https://opentechnical.org/p/OT-2026-000003468
Categories: Lifting, Positioning & Manipulation > Vacuum Lifting

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ABSTRACT

Suction device for handling a semiconductor wafer comprises a handling section
having a plurality of suction ports opened in the same plane as the surface of
the wafer and located within an area smaller than that of the surface of the
wafer, a pressure reduction device connected to the suction port, an opening
acts to release negative pressure produced by the pressure reduction device
when a finger is released therefrom, and a grip integrally coupled to the
handling section.

1. Drawings

[0001] Sheet 1.

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OpenTechnical publication OT-2026-000003468
Published 2026-09-15T20:31:25.426194Z
https://opentechnical.org/p/OT-2026-000003468