---
publication_id: "OT-2026-000003474"
title: "Vacuum chuck apparatus for wet processing wafers"
published_at: "2026-09-15T20:32:12.143044Z"
canonical_url: "https://opentechnical.org/p/OT-2026-000003474"
categories:
  - "material-handling/conveying-systems"
keywords:
  - "b65g47/911"
  - "b65g47/911"
  - "h10p72/0402"
  - "b25j15/06"
  - "b65g1/00"
  - "b65g1/07"
---

# Vacuum chuck apparatus for wet processing wafers

## Abstract

A vacuum chuck apparatus operable in both gas and liquid includes a liquid-gas separating membrane which allows passage of gas molecules but prevents passage of liquid. The liquid-gas separating membrane is disposed between an inlet hole of the chuck and a manifold which is connected to a pneumatic system. The pneumatic system includes an aspirator, a compressor and a switching valve. The vacuum chuck is immersed into a liquid, compressed gas purges the liquid in the inlet hole, then the switching valve is switched to the aspirator. An object, such as a semiconductor wafer, is vacuumed quickly to the chuck, and the inlet hole is closed by the object. If a small quantity of liquid intrudes into the chuck, it is stopped by the liquid-gas separating membrane.

## 1. Drawings

[0001] Sheet 1.

[0002] Sheet 2.

[0003] Sheet 3.

[0004] Sheet 4.

[0005] Sheet 5.

[0006] Sheet 6.