OPENTECHNICAL PUBLICATION
OT-2026-000003474

Vacuum chuck apparatus for wet processing wafers

Published: 2026-09-15T20:32:12.143044Z
Permanent URL: https://opentechnical.org/p/OT-2026-000003474
Categories: Material Handling > Conveying Systems

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ABSTRACT

A vacuum chuck apparatus operable in both gas and liquid includes a liquid-gas
separating membrane which allows passage of gas molecules but prevents passage
of liquid. The liquid-gas separating membrane is disposed between an inlet
hole of the chuck and a manifold which is connected to a pneumatic system. The
pneumatic system includes an aspirator, a compressor and a switching valve.
The vacuum chuck is immersed into a liquid, compressed gas purges the liquid
in the inlet hole, then the switching valve is switched to the aspirator. An
object, such as a semiconductor wafer, is vacuumed quickly to the chuck, and
the inlet hole is closed by the object. If a small quantity of liquid intrudes
into the chuck, it is stopped by the liquid-gas separating membrane.

1. Drawings

[0001] Sheet 1.

[0002] Sheet 2.

[0003] Sheet 3.

[0004] Sheet 4.

[0005] Sheet 5.

[0006] Sheet 6.

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OpenTechnical publication OT-2026-000003474
Published 2026-09-15T20:32:12.143044Z
https://opentechnical.org/p/OT-2026-000003474