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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-12605747-B2, on 21 April 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000000226

Wafer wet cleaning system

Published
Permanent URL
Classification
Manufacturing & Assembly Equipment › Surface Treatment
Original source
US-12605747-B2, the United States Patent and Trademark Office, 21 April 2026
Document SHA-256
3f9261336395f611eeb532d335c319d48959b855430689cf1fd933061bad30ce

Abstract

The present disclosure describes a wafer cleaning process in which a drained cleaning solution, which is used to remove metal contaminants from the wafer, is sampled and analyzed to determine the concentration of metal ions in the solution. The wafer cleaning process includes dispensing, in a wafer cleaning station, a chemical solution on one or more wafers; collecting the dispensed chemical solution; determining a concentration of contaminants in the chemical solution; in response to the concentration of the contaminants being greater than a baseline value, adjusting one or more parameters in the cleaning process; and in response to the concentration of the contaminants being equal to or less than the baseline value, transferring the one or more wafers out of the wafer cleaning station.

Publication information

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Citation

OpenTechnical Publication OT-2026-000000226, “Wafer wet cleaning system,” published September 15, 2026 at 19:02:37 UTC, https://opentechnical.org/p/OT-2026-000000226.

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This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.