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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-12605794-B2, on 21 April 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000000249

Flux and solder paste

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Classification
Manufacturing & Assembly Equipment › Joining and Welding
Original source
US-12605794-B2, the United States Patent and Trademark Office, 21 April 2026
Document SHA-256
b2c2c273b57d519bd627bf04bdce56824fa65ab146e54034950dadf099a6ccda

Abstract

The present invention employs a flux containing a resin component, an activator, and a solvent. The resin component contains a copolymer (A) having an alkene-derived repeating unit (a1), and an acrylic acid-derived repeating unit (a2) in which a hydrogen atom bonded to a carbon atom at an α-position may be substituted with a substituent, and contains a rosin (B). A mixing ratio of the copolymer (A) and the rosin (B) is 1 or more as a mass ratio represented by copolymer (A)/rosin (B).

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Citation

OpenTechnical Publication OT-2026-000000249, “Flux and solder paste,” published September 15, 2026 at 19:02:39 UTC, https://opentechnical.org/p/OT-2026-000000249.

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