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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-2026102855-A1, on 16 April 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000000484

Laser annealing system and method of fabricating a semiconductor device using the same

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Classification
Manufacturing & Assembly Equipment › Joining and Welding
Original source
US-2026102855-A1, the United States Patent and Trademark Office, 16 April 2026
Document SHA-256
ac82e4fd2bf8b105d0e6126a17275083d55a0da08408fd8330be5c5870d8d874

Abstract

Disclosed are a laser annealing system and a method of fabricating a semiconductor device using the same. The laser annealing system having multiple laser devices may include a stage, on which a substrate is loaded, a light source generating a plurality of laser beams to be provided to the substrate, an optical delivery system disposed between the light source and the stage and used to deliver the laser beams, a homogenizing system disposed between the optical delivery system and the stage, the homogenizing system including an array lens including a plurality of lens cells which allow the laser beams to pass therethrough and homogenize the laser beams, and an imaging optical system disposed between the homogenizing system and the stage to image the laser beams on the substrate.

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Citation

OpenTechnical Publication OT-2026-000000484, “Laser annealing system and method of fabricating a semiconductor device using the same,” published September 15, 2026 at 19:02:57 UTC, https://opentechnical.org/p/OT-2026-000000484.

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This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.