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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-2026104098-A1, on 16 April 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000000549

Multi-way valve and a heat pump system including the same

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Classification
Industrial Motion & Power Transmission › Fluid Power
Original source
US-2026104098-A1, the United States Patent and Trademark Office, 16 April 2026
Document SHA-256
047ce8a798997d833bd84e3b27bc3208f104f359e3c497e5e797527068c7c49e

Abstract

A heat pump system includes a multi-way valve. The multi-way valve includes a valve housing including a plurality of inlets/outlets formed along a circumference of the valve housing, an open lower portion, and a first connection flow path rotatably provided inside the valve housing. The multi-way valve further includes a valve body in which a second connection flow path is formed. The heat pump system further includes: a driver configured to selectively rotate the valve body; a first refrigerant line disposed below the valve housing and through which a refrigerant flows; and a second refrigerant line, a third refrigerant line, a fourth refrigerant line and a fifth refrigerant line, which are arranged to be spaced apart from each other sequentially at a set angle along a circumference of the multi-way valve.

Publication information

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Citation

OpenTechnical Publication OT-2026-000000549, “Multi-way valve and a heat pump system including the same,” published September 15, 2026 at 19:03:03 UTC, https://opentechnical.org/p/OT-2026-000000549.

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