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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-12599988-B2, on 14 April 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000000759

Process of making components for electronic and optical devices using laser processing

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Classification
Manufacturing & Assembly Equipment › Joining and Welding
Original source
US-12599988-B2, the United States Patent and Trademark Office, 14 April 2026
Document SHA-256
ab2cfa1d0bb0cba703388a444b18e21e79717772cece4954ef73c4223fe47821

Abstract

The present invention relates to processes of making components for electronic and optical devices using laser processing and devices comprising such components. Such process uses a laser to introduce chemical and/or structural changes in substrates and films that are the raw materials from which components for electronic and optical devices are made. Such process yields components that can have one or more electronic and/or optical functionalities that are integrated on the same substrate or film. In addition, such process does not require large-scale clean rooms and is easily configurable. Thus, rapid device prototyping, design change and evolution in the lab and on the production side is realized.

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Citation

OpenTechnical Publication OT-2026-000000759, “Process of making components for electronic and optical devices using laser processing,” published September 15, 2026 at 19:03:21 UTC, https://opentechnical.org/p/OT-2026-000000759.

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This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.