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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-2026084320-A1, on 26 March 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000001383

Robot gripper for moving wafer carriers and packing materials and method of operating the same

Published
Permanent URL
Classification
Robotics & Automation › Robot Architectures
Inventors
CHEN CHIH-HUA, CHEN CHI-WEI, HUNG FU-CHENG, LEE CHIEN-FA, WU FENG-KUANG
Assignee
TAIWAN SEMICONDUCTOR MFG CO LTD
Original source
US-2026084320-A1, the United States Patent and Trademark Office, 26 March 2026
Document SHA-256
ff27f607feb44ac5d6a0a7f32344b186e7768602ca76c1ca6938e84d0bc25516

Abstract

A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.

Publication information

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Citation

OpenTechnical Publication OT-2026-000001383, “Robot gripper for moving wafer carriers and packing materials and method of operating the same,” published September 15, 2026 at 19:05:30 UTC, https://opentechnical.org/p/OT-2026-000001383.

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This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.