OpenTechnical
This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-12565003-B2, on 3 March 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000002412

Techniques for powder delivery in additive fabrication and related systems and methods

Published
Permanent URL
Classification
Manufacturing & Assembly Equipment › Additive Manufacturing
Inventors
EVANS GREGORY CONNOR, JOHNSON JOSEPH, MORGAN ROBERT, PLUMMER LUKE, RUIZ MARIA ROSA, RUIZ-VARGAS CARLOS
Assignee
FORMLABS INC
Original source
US-12565003-B2, the United States Patent and Trademark Office, 3 March 2026
Document SHA-256
04d5199497470a1f84fc222a570c3e535d58728b194194858f495cbb7698f5dd

Abstract

Techniques are described for consistently moving powder from a hopper into a trough for subsequent delivery into a build area of an additive fabrication system. A powder conveyer may be arranged at least partially within the hopper and configured to be actuated to transfer powder to the trough. The powder conveyer may be formed as a screw conveyor, for example. Such techniques do not require complex closed-loop control systems and may be effective irrespective of the flowability of the powder. In at least some cases, there may be no production of excess powder because the amount of powder that is metered into the trough may be precisely controlled to be the amount needed for recoating.

Publication information

Citation

OpenTechnical Publication OT-2026-000002412, “Techniques for powder delivery in additive fabrication and related systems and methods,” published September 15, 2026 at 19:12:49 UTC, https://opentechnical.org/p/OT-2026-000002412.

To cite specific content, add the paragraph or figure numbers.

Terms

This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.