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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-6279976-B1, on 28 August 2001. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000003098

Wafer handling device having conforming perimeter seal

Published
Permanent URL
Classification
Material Handling › Conveying Systems
Inventors
BALL MICHAEL B
Assignee
MICRON TECHNOLOGY INC
Original source
US-6279976-B1, the United States Patent and Trademark Office, 28 August 2001
Document SHA-256
0331c9876f65a150eccbfd8b5ef182e26f2b2c80cac8b46f9fcee4f98c3f5ab9

A vacuum-assisted chuck assembly for coupling to a warped semiconductor wafer is provided. In one embodiment, the assembly comprises a wafer chuck and a conforming perimeter seal. The seal permits effective vacuum coupling of the chuck to the warped wafer without operator intervention. As vacuum pressure is applied, the seal prevents leakage around the warped wafer, allowing the vacuum pressure to deflect the wafer until the wafer contacts and seals against an engaging surface located on the chuck. By utilizing the seal, the chuck assembly may operate at a reduced vacuum pressure as compared to conventional wafer chucks. Furthermore, by providing an effective vacuum seal to the warped wafer surface, manual operator intervention during vacuum coupling is reduced or eliminated.

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Abstract

A vacuum-assisted chuck assembly for coupling to a warped semiconductor wafer is provided. In one embodiment, the assembly comprises a wafer chuck and a conforming perimeter seal. The seal permits effective vacuum coupling of the chuck to the warped wafer without operator intervention. As vacuum pressure is applied, the seal prevents leakage around the warped wafer, allowing the vacuum pressure to deflect the wafer until the wafer contacts and seals against an engaging surface located on the chuck. By utilizing the seal, the chuck assembly may operate at a reduced vacuum pressure as compared to conventional wafer chucks. Furthermore, by providing an effective vacuum seal to the warped wafer surface, manual operator intervention during vacuum coupling is reduced or eliminated.

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Publication information

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Citation

OpenTechnical Publication OT-2026-000003098, “Wafer handling device having conforming perimeter seal,” published September 15, 2026 at 19:28:29 UTC, https://opentechnical.org/p/OT-2026-000003098.

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This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.