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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-6164633-A, on 26 December 2000. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000003121

Multiple size wafer vacuum chuck

Published
Permanent URL
Classification
Tools & Tooling › Clamping Tools
Inventors
MULLIGAN VINCENT P, TOMPKINS JR CHARLES R, YUEN WING FUNG
Assignee
IBM
Original source
US-6164633-A, the United States Patent and Trademark Office, 26 December 2000
Document SHA-256
b215338a07be490ff9c952a2553277e6d9d507a136ca69e83b6420bf2e3817c0

A vacuum holding chuck is presented. The vacuum holding chuck of the present invention is particularly well suited for holding semiconductor wafers of multiple diameters during various testing and manufacturing operations. In an exemplary embodiment, the vacuum chuck comprises a body having a first surface and an opposing second surface, wherein the first surface includes first and second recessed circular platforms to receive wafers having first and second diameters, respectively. The second surface includes at least one recessed circular platform to receive a wafer having a third diameter. Each circular platform is defined at least in part by an annular shoulder and each circular platform further includes a vacuum trough which is connected to a vacuum source which when activated, evacuates the air from the vacuum trough and securely holds a wafer in place within the circular platform.

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Abstract

A vacuum holding chuck is presented. The vacuum holding chuck of the present invention is particularly well suited for holding semiconductor wafers of multiple diameters during various testing and manufacturing operations. In an exemplary embodiment, the vacuum chuck comprises a body having a first surface and an opposing second surface, wherein the first surface includes first and second recessed circular platforms to receive wafers having first and second diameters, respectively. The second surface includes at least one recessed circular platform to receive a wafer having a third diameter. Each circular platform is defined at least in part by an annular shoulder and each circular platform further includes a vacuum trough which is connected to a vacuum source which when activated, evacuates the air from the vacuum trough and securely holds a wafer in place within the circular platform.

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Publication information

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Citation

OpenTechnical Publication OT-2026-000003121, “Multiple size wafer vacuum chuck,” published September 15, 2026 at 19:33:16 UTC, https://opentechnical.org/p/OT-2026-000003121.

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Terms

This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.