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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-5799994-A, on 1 September 1998. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000003203

Wafer handling tool with vacuum pickup

Published
Permanent URL
Classification
Lifting, Positioning & Manipulation › Vacuum Lifting
Assignee
TAIWAN SEMICONDUCTOR MFG
Original source
US-5799994-A, the United States Patent and Trademark Office, 1 September 1998
Document SHA-256
3d002143541e321eb095f90b8e01f9911ffdb8ad444811ee3629232435b1d48c

A hand operated tool for picking up a semiconductor wafer includes a vacuum cylinder with a piston. The user first pushes the piston to its forward most position against the force of a spring and a catch mechanism locks the piston in this position. Later, the user presses a button to release the catch mechanism and allow the piston to move to its rear most position in response to the force of the spring. The motion of the piston creates a suitable vacuum in the front part of the cylinder. A vacuum head is attached to the forward end of the cylinder. It has a generally square flat surface with sides about one third the diameter of a wafer. The user positions this surface in contact with a wafer and then pushes the button to releases the piston and apply a vacuum to grasp the wafer. The user moves the wafer to its destination and then presses a second button to allow air to enter the vacuum side of the cylinder and thereby release the grasp on the wafer.

Sheet 1
Sheet 1

Abstract

A hand operated tool for picking up a semiconductor wafer includes a vacuum cylinder with a piston. The user first pushes the piston to its forward most position against the force of a spring and a catch mechanism locks the piston in this position. Later, the user presses a button to release the catch mechanism and allow the piston to move to its rear most position in response to the force of the spring. The motion of the piston creates a suitable vacuum in the front part of the cylinder. A vacuum head is attached to the forward end of the cylinder. It has a generally square flat surface with sides about one third the diameter of a wafer. The user positions this surface in contact with a wafer and then pushes the button to releases the piston and apply a vacuum to grasp the wafer. The user moves the wafer to its destination and then presses a second button to allow air to enter the vacuum side of the cylinder and thereby release the grasp on the wafer.

1. Drawings

[0001]Sheet 1.

Publication information

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Citation

OpenTechnical Publication OT-2026-000003203, “Wafer handling tool with vacuum pickup,” published September 15, 2026 at 19:48:37 UTC, https://opentechnical.org/p/OT-2026-000003203.

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This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.