OT-2026-000003380
Suction pad
- Published
- Permanent URL
- https://opentechnical.org/p/OT-2026-000003380
- Classification
- Material Handling › Conveying Systems
- Inventors
- KAWAMOTO TADASU, NAGAI SHIGEKAZU, SAKURAI SHUUZOU
- Assignee
- SMC KK
- Original source
- US-5192070-A, the United States Patent and Trademark Office, 9 March 1993
- Document SHA-256
- 73146564b27482cdc9250432f1b1c4b9b6cb50a557492d9c1257001459f57fc4
Disclosed herein is a suction pad for attracting and holding a work, which comprises a suction base coupled via a connector to a vacuum suction source, a suction skirt integrally provided in continuation with the base, and a vacuum chamber which is defined inside the suction pad and communicates with the inside of the skirt. In addition, the suction pad includes a plurality of smaller-diameter through holes which cause the vacuum chamber to communicate with a suction surface of the skirt, and partition walls for surrounding the through holes. The partition walls define a number of small vacuum chambers.
Abstract
Disclosed herein is a suction pad for attracting and holding a work, which comprises a suction base coupled via a connector to a vacuum suction source, a suction skirt integrally provided in continuation with the base, and a vacuum chamber which is defined inside the suction pad and communicates with the inside of the skirt. In addition, the suction pad includes a plurality of smaller-diameter through holes which cause the vacuum chamber to communicate with a suction surface of the skirt, and partition walls for surrounding the through holes. The partition walls define a number of small vacuum chambers.
1. Drawings
[0001]Sheet 1.
[0002]Sheet 2.
[0003]Sheet 3.
Publication information
Citation
OpenTechnical Publication OT-2026-000003380, “Suction pad,” published September 15, 2026 at 20:19:08 UTC, https://opentechnical.org/p/OT-2026-000003380.
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Terms
This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.


