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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-2026102842-A1, on 16 April 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000000471

Bonding strength inspection apparatus and bonding system

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Classification
Manufacturing & Assembly Equipment › Joining and Welding
Original source
US-2026102842-A1, the United States Patent and Trademark Office, 16 April 2026
Document SHA-256
75332fca4f07471b97396f66a06ccd5bdb1cc4611fe25155aaaaafd1457fb15f

Abstract

The present disclosure relates to a bonding strength inspection apparatus capable of inspecting a bonding strength of a bonding part without destruct an inspection target. The present disclosure provides a bonding strength inspection apparatus including a roughness measurement part configured to measure a roughness of a bonding part in which a base metal and a bonding member are bonded to each other; and a processor configured to determine a bonding strength of the bonding part based on the roughness.

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Citation

OpenTechnical Publication OT-2026-000000471, “Bonding strength inspection apparatus and bonding system,” published September 15, 2026 at 19:02:55 UTC, https://opentechnical.org/p/OT-2026-000000471.

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