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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-2026061609-A1, on 5 March 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000002237

Jigs and methods of teaching substrate handling in semiconductor processing systems using jigs

Published
Permanent URL
Classification
Robotics & Automation › Robot Architectures
Inventors
CHEN DONGYANG
Assignee
ASM IP HOLDING BV
Original source
US-2026061609-A1, the United States Patent and Trademark Office, 5 March 2026
Document SHA-256
dd6346dc01594af61696e26560ae53d674873e3c1bd1c3200ba85123a2cd7735

Abstract

A jig includes a disc body, a fixation pin, and a verification pin. The disc body has a first surface, an opposite a second surface, and a thickness separating the first surface from the second surface. A fixation aperture and a verification aperture extend through the thickness of the disc body and couple the first surface to the second surface of the disc body, the fixation aperture located radially outward of the verification aperture. The fixation pin is arranged to be slidably received within the fixation aperture to fix the disc body to an end effector within the semiconductor processing system. The verification pin is arranged to be slidably received within the verification aperture and supported by the disc body to indicate misregistration between the disc body and a load lock in the semiconductor processing system.

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Citation

OpenTechnical Publication OT-2026-000002237, “Jigs and methods of teaching substrate handling in semiconductor processing systems using jigs,” published September 15, 2026 at 19:11:39 UTC, https://opentechnical.org/p/OT-2026-000002237.

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This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.