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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-2001049256-A1, on 6 December 2001. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000003079

Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same

Published
Permanent URL
Classification
Tools & Tooling › Clamping Tools
Inventors
ARAI KAZUHISA, TAKAHASHI TOSHIAKI
Original source
US-2001049256-A1, the United States Patent and Trademark Office, 6 December 2001
Document SHA-256
424d10b7d566eefebff2031aa5e578db4eba10d5136dd6e89a1d1e80df8d0cd5

A semiconductor wafer assembly is constituted such that the back surface of a tape is stuck to the surface of a frame and a semiconductor wafer is stuck to the surface of the tape. A machining apparatus has chuck tables for supporting the semiconductor wafer assembly, and each of the chuck tables has a semiconductor wafer placing surface for supporting the back surface of the tape to which the semiconductor wafer is stuck and an annular frame placing surface for supporting the back surface of the frame, formed, in the outer peripheral side of the semiconductor wafer mounting surface, at a position below the semiconductor wafer placing surface with a level difference therebetween.

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Abstract

A semiconductor wafer assembly is constituted such that the back surface of a tape is stuck to the surface of a frame and a semiconductor wafer is stuck to the surface of the tape. A machining apparatus has chuck tables for supporting the semiconductor wafer assembly, and each of the chuck tables has a semiconductor wafer placing surface for supporting the back surface of the tape to which the semiconductor wafer is stuck and an annular frame placing surface for supporting the back surface of the frame, formed, in the outer peripheral side of the semiconductor wafer mounting surface, at a position below the semiconductor wafer placing surface with a level difference therebetween.

1. Drawings

[0001]Sheet 1.

[0002]Sheet 2.

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[0007]Sheet 7.

Publication information

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Citation

OpenTechnical Publication OT-2026-000003079, “Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same,” published September 15, 2026 at 19:24:24 UTC, https://opentechnical.org/p/OT-2026-000003079.

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This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.