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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-12558734-B2, on 24 February 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000002571

Multi-layer ceramic plate device

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Classification
Manufacturing & Assembly Equipment › Joining and Welding
Inventors
BALMA FRANK, ELLIOT ALFRED GRANT, ELLIOT BRENT DONALD ALFRED, PARKER MICHAEL, REX DENNIS GEORGE, SCHUSTER RICHARD ERICH, VEYTSER ALEXANDER
Assignee
WATLOW ELECTRIC MFG
Original source
US-12558734-B2, the United States Patent and Trademark Office, 24 February 2026
Document SHA-256
86c686e1172e9fd06e31290da4e64bee0cc16b520684a8302ca56b0c81f3b1c7

Abstract

An electrostatic chuck includes a ceramic top plate layer made of a beryllium oxide material, a ceramic bottom plate layer made of a beryllium oxide material, a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer, an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer, and a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer. The electrode layer joins and hermetically seals the ceramic top plate layer to the ceramic middle plate layer, and the heater layer joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer.

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Citation

OpenTechnical Publication OT-2026-000002571, “Multi-layer ceramic plate device,” published September 15, 2026 at 19:13:55 UTC, https://opentechnical.org/p/OT-2026-000002571.

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This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.