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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-12557600-B2, on 17 February 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000002883

Semiconductor device manufacturing device and manufacturing method

Published
Permanent URL
Classification
Robotics & Automation › Robot Architectures
Inventors
TAKAHASHI MAKOTO
Assignee
YAMAHA ROBOTICS CO LTD
Original source
US-12557600-B2, the United States Patent and Trademark Office, 17 February 2026
Document SHA-256
f8673be5683b0829aeea30aa6fc421bce9006b4d9806335084bf50864c029c9c

Abstract

This semiconductor device manufacturing device comprises: a stage; a bonding head; a copying mechanism provided on the bonding head; and a controller that executes the copying process to adjust a facing surface to be parallel to a reference plane by having the facing surface, which is a holding surface or a chip end face, follow the reference plane 110 , which is a planar surface of the stage or a substrate. In the copying process, the controller moves the bonding head relative to the surface direction of the reference plane with the facing surface left abutting the reference plane in a state with the copying mechanism switched to a free state, until the axial direction position of the bonding head reaches a stipulated reference position, and when the axial direction position reaches the reference position, switches the copying mechanism to a locked state.

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Citation

OpenTechnical Publication OT-2026-000002883, “Semiconductor device manufacturing device and manufacturing method,” published September 15, 2026 at 19:15:58 UTC, https://opentechnical.org/p/OT-2026-000002883.

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