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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-5632434-A, on 27 May 1997. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000003256

Pressure activated diaphragm bonder

Published
Permanent URL
Classification
Manufacturing & Assembly Equipment › Joining and Welding
Assignee
UNIV CALIFORNIA
Original source
US-5632434-A, the United States Patent and Trademark Office, 27 May 1997
Document SHA-256
133e83265429e099e349f9e60180117932c924adada16c411bea5e4fa97ae63a

A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.

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Abstract

A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.

1. Drawings

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Publication information

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Citation

OpenTechnical Publication OT-2026-000003256, “Pressure activated diaphragm bonder,” published September 15, 2026 at 19:57:12 UTC, https://opentechnical.org/p/OT-2026-000003256.

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