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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-4904012-A, on 27 February 1990. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000003468

Suction device

Published
Permanent URL
Classification
Lifting, Positioning & Manipulation › Vacuum Lifting
Assignee
SUMITOMO ELECTRIC INDUSTRIES
Original source
US-4904012-A, the United States Patent and Trademark Office, 27 February 1990
Document SHA-256
87539d9d50cf3179e0d5ec5763aeafb4aea2f0a9815d2bc8c100cd0136481359

Suction device for handling a semiconductor wafer comprises a handling section having a plurality of suction ports opened in the same plane as the surface of the wafer and located within an area smaller than that of the surface of the wafer, a pressure reduction device connected to the suction port, an opening acts to release negative pressure produced by the pressure reduction device when a finger is released therefrom, and a grip integrally coupled to the handling section.

Sheet 1
Sheet 1

Abstract

Suction device for handling a semiconductor wafer comprises a handling section having a plurality of suction ports opened in the same plane as the surface of the wafer and located within an area smaller than that of the surface of the wafer, a pressure reduction device connected to the suction port, an opening acts to release negative pressure produced by the pressure reduction device when a finger is released therefrom, and a grip integrally coupled to the handling section.

1. Drawings

[0001]Sheet 1.

Publication information

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Citation

OpenTechnical Publication OT-2026-000003468, “Suction device,” published September 15, 2026 at 20:31:25 UTC, https://opentechnical.org/p/OT-2026-000003468.

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Terms

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