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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-4858975-A, on 22 August 1989. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000003474

Vacuum chuck apparatus for wet processing wafers

Published
Permanent URL
Classification
Material Handling › Conveying Systems
Inventors
OGAWA TSUTOMU
Assignee
FUJITSU LTD
Original source
US-4858975-A, the United States Patent and Trademark Office, 22 August 1989
Document SHA-256
7ab8aca2f22f12eef674e95fc76b73fd8d4849a41b8e71fc2f14d826c153270b

A vacuum chuck apparatus operable in both gas and liquid includes a liquid-gas separating membrane which allows passage of gas molecules but prevents passage of liquid. The liquid-gas separating membrane is disposed between an inlet hole of the chuck and a manifold which is connected to a pneumatic system. The pneumatic system includes an aspirator, a compressor and a switching valve. The vacuum chuck is immersed into a liquid, compressed gas purges the liquid in the inlet hole, then the switching valve is switched to the aspirator. An object, such as a semiconductor wafer, is vacuumed quickly to the chuck, and the inlet hole is closed by the object. If a small quantity of liquid intrudes into the chuck, it is stopped by the liquid-gas separating membrane.

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Abstract

A vacuum chuck apparatus operable in both gas and liquid includes a liquid-gas separating membrane which allows passage of gas molecules but prevents passage of liquid. The liquid-gas separating membrane is disposed between an inlet hole of the chuck and a manifold which is connected to a pneumatic system. The pneumatic system includes an aspirator, a compressor and a switching valve. The vacuum chuck is immersed into a liquid, compressed gas purges the liquid in the inlet hole, then the switching valve is switched to the aspirator. An object, such as a semiconductor wafer, is vacuumed quickly to the chuck, and the inlet hole is closed by the object. If a small quantity of liquid intrudes into the chuck, it is stopped by the liquid-gas separating membrane.

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Publication information

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Citation

OpenTechnical Publication OT-2026-000003474, “Vacuum chuck apparatus for wet processing wafers,” published September 15, 2026 at 20:32:12 UTC, https://opentechnical.org/p/OT-2026-000003474.

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This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.