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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-2026103351-A1, on 16 April 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000000585

Dechuck control method, dechuck control system, method of transferring substrate

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Classification
Material Handling › Conveying Systems
Original source
US-2026103351-A1, the United States Patent and Trademark Office, 16 April 2026
Document SHA-256
38a8ad4fbbfe410fb582861c7e65b1ff7df9005802871683472e5a9750f0ae5d

Abstract

Provided herein may be a dechuck control method, a dechuck control system, and a method of transferring a substrate. The dechuck control method may include: providing a substrate and a carrier coupled to each other by an adhesive chuck; pushing the substrate by a dechuck pin including a pressure sensor, and acquiring, by the pressure sensor, pressure data associated with pushing the substrate by the dechuck pin; and controlling an operation of the dechuck pin based on the pressure data.

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Citation

OpenTechnical Publication OT-2026-000000585, “Dechuck control method, dechuck control system, method of transferring substrate,” published September 15, 2026 at 19:03:07 UTC, https://opentechnical.org/p/OT-2026-000000585.

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