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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-12552619-B2, on 17 February 2026. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000002827

Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus

Published
Permanent URL
Classification
Material Handling › Conveying Systems
Inventors
CHOI JIN HYUK, CHUN HYUN SOO, HWANG BEOM SOO, JEON HYUN JOO, LEE KONG WOO, LEE KYU SANG, SONG MYUNG KI, UH JI HO
Assignee
SAMSUNG ELECTRONICS CO LTD
Original source
US-12552619-B2, the United States Patent and Trademark Office, 17 February 2026
Document SHA-256
164eaa80a6f7faf168ab724a18b70a5686a7f47f915afc31e617965aadbb63ae

Abstract

A wafer transfer apparatus includes a plate, a first belt unit on a first surface of the plate and including a first linear motion (LM) guide movable up and down, a second belt unit on the first surface of the plate and including a second LM guide movable up and down, a robot between the first belt unit and the second belt unit connected to the first LM guide and the second LM guide, and configured to transfer a wafer in a vertical direction, and a buffer unit between the first belt unit and the second belt unit in a first direction and disposed between the plate and the robot in a second direction perpendicular to the first direction, wherein the buffer unit includes a plurality of centrifugal fans configured to discharge fluid from an inner space of the buffer unit to an outside of the buffer unit.

Publication information

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Citation

OpenTechnical Publication OT-2026-000002827, “Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus,” published September 15, 2026 at 19:15:36 UTC, https://opentechnical.org/p/OT-2026-000002827.

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