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This is a record of a document published elsewhere, first published by the United States Patent and Trademark Office, as US-5746462-A, on 5 May 1998. OpenTechnical did not first disclose it. The identifier, hashes and timestamps below record what this library served and when, not when the material became public. View the original.

OT-2026-000003219

Flexible vacuum pick-up device

Published
Permanent URL
Classification
Robotics & Automation › Robot Architectures
Inventors
CHEN Y H, LEE C H
Assignee
TAIWAN SEMICONDUCTOR MFG
Original source
US-5746462-A, the United States Patent and Trademark Office, 5 May 1998
Document SHA-256
ef6a898bf312fbd965adf24321b6f2db176454b238ae03a3f440eecb71b8e5d5

The present invention discloses a flexible vacuum pick-up device for use in wafer processing that includes a handle portion adapted for holding by a human hand, the handle portion has a passage therein for fluid communication, a flexible conduit for providing a connection between the handle portion and a pick-up head and for providing a vacuum passage therethrough, and a vacuum pick-up head that has an extended planar surface adapted for making intimate contact with a substantially flat wafer.

Sheet 1
Sheet 1

Abstract

The present invention discloses a flexible vacuum pick-up device for use in wafer processing that includes a handle portion adapted for holding by a human hand, the handle portion has a passage therein for fluid communication, a flexible conduit for providing a connection between the handle portion and a pick-up head and for providing a vacuum passage therethrough, and a vacuum pick-up head that has an extended planar surface adapted for making intimate contact with a substantially flat wafer.

1. Drawings

[0001]Sheet 1.

Publication information

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Citation

OpenTechnical Publication OT-2026-000003219, “Flexible vacuum pick-up device,” published September 15, 2026 at 19:51:25 UTC, https://opentechnical.org/p/OT-2026-000003219.

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This record reproduces a document published elsewhere and is provided for reference and study. Rights in the original remain with its owner. See the publication policy.